Time
Day 1: October 14, 2025
7:30 – 9:00
Registration & Breakfast
8:45 – 9:00
Opening Remarks – PAINE 2024 Awards
General Chair and Program Chair
Plenary Session I
Chair: Nathan Edwards – Rapid Innovation & Security Experts Inc.
9:00 – 9:30
Keynote Talk I: Bridging Virtual and Physical: Accelerating U.S. Semiconductor Innovation with Digital Twin Technologies
Dr. Paris Stringfellow – SMART USA Institute
9:30 – 10:00
Break
SESSION I: Invited Talks
Chair: Dr Edward Jimenez – Sandia National Laboratory
10:00 – 10:20
Metrology Challenges & Solutions for Hybrid Bonding
Dr. Bongsub Lee – ADEIA
10:20 – 10:40
The Evolution of Electronics Packaging to Chiplet Architecture
Dr. Charles Woychik – Nhanced Semiconductors, Inc.
10:40 – 11:00
Buried Truths: Limitations and Opportunities in Non-Invasive Thermal Analysis for 2.5D/3D ICs
Dr. Mo Shakouri – Microsanj
11:00 – 11:20
Enhancing Supply Chain Trust and Assurance with Artificial Intelligence
Dr. Matthew Areno – Midwest Microelectronics Consortium
11:20 – 11:40
FSE Assurance and 3-D Advanced HI Packaging Failure Analysis Lab
Matt Walsh – Florida Semiconductor ENGINE
11:40 – 1:00
Lunch
Plenary Session II
Chair: David Torres – Red Ballon Security
1:00 – 1:20
Visionary 1: Navigating the Post-Generative AI Era of Failure Analysis
Dr. Joy Liao – Nvidia
SESSION II: Special Session SEMI
Chair: Anshu Bahadur
1:20 – 2:20
Virtual Metrology
Dr. Min Gao – EMD Electronics
Steve Cho – Gauss Labs
Dr. Surya Kalidindi – Multiscale Technologies
2:20 – 2:50
Break
SESSION III: Paper Presentations
Chair: Emily Haines – Battelle
2:50 – 3:10
Lurking in the Shadows: Challenges for X-Ray Inspection to Uncover Electromigration-Based Hardware Trojans in Advanced Packaging
Katayoon Yahyaei – University of Florida
3:10 – 3:30
X-Ray Fault Injection Localization with a Shield on Powered and Unpowered Devices
Paul Grandamme – Université Jean Monnet-France
3:30 – 3:50
Metaheuristic Color Scheme Strategies for Enhanced Visual Inspection of 3D IC Layouts
Zhansen Shi – National University of Singapore
3:50 – 4:10
Magnetic Field Imaging using Diamond Nitrogen-Vacancy Centers for Fault Detection and Security of Semiconductor and Superconductor Electronics
Pauli Kehayias – MIT Lincoln Laboratory
4:10 – 5:30
Exhibit and Poster Session
5:30 – 7:30
Social Event
Time
Day 2: October 15, 2025
7:00 – 8:30
Breakfast
Plenary Session III
Chair: Dr. Adam Waite – Battelle
8:30 – 9:00
Keynote Talk II: Next-Generation Microelectronics Manufacturing
Saverio Fazzari – Booz Allen Hamilton
9:00 – 9:30
Visionary 2: Keeping up with Moore’s Law: Silicon Reliability and Product Qualification challenges due to Technology Scaling
Amit Marathe – Google
9:30 – 9:50
Break
SESSION IV: Fireside Chat
Moderator: Saverio Fazzari
9:50 – 10:50
Topic: The Intersection of Government and Commercial Microelectronics
Dr. William Zortman, Dr. Matthew Areno
10:50 – 11:10
Break
SESSION V: Invited Talks
Chair: Dr. Eric Cotts – Binghamton University
11:10 – 11:30
Hardware security vulnerabilities: Lessons learnt after nearly 800+bugs
Dr. Jeyavijayan “JV” Rajendran – Texas A&M University
11:30 – 11:50
Adventures in Hyperspectral Computed Tomography for Non-destructive Hardware Evaluation
Dr. Eric Goodman – Sandia National Laboratories
11:50 – 12:10
Electron Beam Assisted Back-Contact Free Electrical Atomic Force Microscopy
Dr. Umberto Celano – Arizona State University
12:10 – 12:30
Defect Imaging of Emerging Memory Materials via Electro-Optical Characterization
Dr. Thomas Beechem – Purdue University
12:30 – 2:00
Lunch
SESSION VI: Panel Discussion
Moderators: Saverio Fazzari – Booz Allen Hamilton
2:00 – 3:30
The Role of AI in Redefining Physical Assurance
Dr. Adam Kimura – Battelle
Dr. Sarah Paluskiewicz – Northrop Grumman
Dr. Navid Asadi – University of Florida
Dr. Julian Warchall – IBM Research
Dr. Edward Jimenez – Sandia National Laboratories
3:30 – 4:00
Break
SESSION VII: Paper Presentations
Chair: Daniel Homiak – Lockheed Martin
4:00 – 4:20
Advancing Microelectronics Evidence-Based Assurance while Preserving Confidentiality: Copia
Nikhil Shenoy – Colvin Run Networks, Inc.
Nathan Edwards – Rapid Innovation and Security Experts, Inc.
4:20 – 4:40
Analysis of Temperature Effect on SRAM PUF For Low Cost Applications
Sayan Samanta – The University of Alabama in Huntsville
4:40 – 5:00
A Quantitative Means for Assessing Failure in SnBi-Based Solder Joints During Current Stressing
Eric Cotts – SUNY Binghamton
5:00 – 5:20
Post-Silicon Functional Verification and Validation: Chip to RTL Analysis
Tim McDonley – Battelle Memorial Institute
5:20 – 5:40
Evaluating multimodal foundation models for few-shot PCB identification and reasoning
Zachary Burns – Leidos Innovations Center
Time
Day 3: October 16, 2025
7:00 – 8:00
Breakfast
Plenary Session IV
Chair: Dave Via – Midwest Microelectronics Consortium
8:00 – 8:30
Keynote Talk III: Secure Design-for-Test and Inspection Techniques for Trusted 3DIC
Antonio De la Serna – Siemens EDA
8:30 – 8:50
Hardware-Enabled Mechanisms for Verifying Responsible AI Development
Will Hodgkins – Center for AI Safety
8:50 – 9:30
Break
SESSION VIII: Invited Talks
Chair: Nikhil Shenoy – Colvin Run Networks
9:30 – 9:50
Mathematical Approaches to Microelectronics Assurance
Dr. Whitney Batchelor – Graf Research
9:50 – 10:10
Deep-Learning Side-Channel Analysis
Dr. Boyang Wang – University of Cincinnati
10:10 – 10:30
Chiplets and Reliability
Dr. Jason Rupe – Cablelabs
10:30 – 10:50
Break
SESSION IX: Paper Presentations
Chair: Dr. Sneha Sudhakaran – Florida Institute of Technology
10:50 – 11:10
Exploiting Electron-Beam Probing for Information Leakage in Advanced-Node Integrated Circuits
M Shafkat M Khan – Thermo Fisher Scientific Inc.
11:10 – 11:30
Efficient Side-channel Leakage Assessment Using Deep Learning-based Feature Extractor and ANOVA
Yuta Fukuda – National Institute of Advanced Industrial Science and Technology – Japan
11:30 – 11:50
Enabling Algorithm Detection in the Presence of Interrupts: Using HAL for Side-Channel Interrupt Detection and Mitigation
Kevin Pintong – Binghamton University
11:50 – 1:00
Lunch
SESSION X: Paper Presentations
Chair: Dr. Akshay Kulkarni – Prairie View A&M University
1:00 – 1:20
Analyzing Sources of Fingerprints in Wireless Modules Using Microwave Measurements
Vishnuvardhan Iyer – National Institute of Standards and Technology
1:20 – 1:40
Multi-Granular Information Flow Tracking in RISC-V based SoCs
Dhruvakumar Aklekar – University of North Carolina at Charlotte
1:40 – 2:00
AuthenTree: A Scalable MPC-Based Distributed Trust Architecture for Chiplet-based Heterogeneous Systems
Ishraq Tashdid – University of Central Florida
2:00 – 2:20
FirmEM: Firmware Flashing Detection via Unintentional Electromagnetic Emissions
Elvan Ugurlu – Aether Argus Inc.
2:20 – 2:50
Break
SESSION XI: Paper Presentations
Chair: Dr. Rayhane Ghane – Ficontec
2:50 – 3:10
A Defense Electronics Supply Chain Root Cause Analysis-based Model to identify data features that are viable for counterfeit predictive analytics
Konstantinos Belesis – George Washington University
3:10 – 3:30
Integrated-Circuit Supply Chain Verification Using Mask Set Comparison in the Open Source Context
Olivier Thomas – Texplained – France
3:30 – 3:50
Power Spectrum Analysis-Based Counterfeit Screening: A Hardware Comparison
Devon Richman – University of Maryland
3:50 – 4:00