Program | Speakers | Sponsorship | Winners | gallery

Past Program Schedule

*All Times are in CST

Time

Day 1: October 24, 2023

7:00 – 8:00

Registration and Breakfast


8:00 – 8:20

Opening remarks – PAINE Awards

General Chair and Program Chair

Plenary Session I

Chair: Dr. Nick Hooten – Invariant Corporation

8:20 – 9:00

Keynote Talk I : CHIPS R&D Metrology Program

Dr. Marla Dowell – National Institute of Standards and Technology

9:00 – 9:40

Visionary Talk: Cut the Clutter Connecting to Leadership

Chris Peters – U.S. Partnership for Assured Electronics.

9:40 – 10:00

Break


SESSION I: Invited Talk

Chair: Dr. Adam Kimura – Battelle

10:00 – 10:20

RESHAPE: Reshore Ecosystem for secure Heterogenous Advanced Packaged Electronics

Alexander Quadrini – Army

10:20 – 10:40

Sustainable Electronics & HW Security/Assurance in the era of European CHIPS Act and the UK National semiconductor state

Dr. Franck Courbon – Ethicronics Ltd

10:40 – 11:00

Nanoscale X-ray Tomography of Integrated Circuits using a Hybrid Electron/X-ray Microscope

Dr. Nathan Nakamura – National Institute of Standards and Technology

11:00 – 11:20

A proficiency scheme for counterfeit part testingeffectiveness

Dan DiMase – Aerocyonics, Inc.

11:20 – 11:40

Break


SESSION II: Paper Presentations

Chair: Dr. Nelson Hastings – NIST

11:40 – 12:00

Simulation-Based Approach to Generating Golden Data for PCB-Level Hardware Trojan Detection using Capacitive Sensor

Shugo Kaji – Nara Institute of Science and Technology

12:00 – 12:20

Rectification for Computed Tomography Scans of Printed Circuit Boards Using Vias as Landmarks

Dr. Alexander Fafard – Two Six Technologies

12:20 – 13:30

Lunch and Exhibit


Plenary Session II

Chair: Dr. Bahar Basim – Intel Corporation

13:30 – 14:10

Keynote Talk II: Trusted and Assured Microelectronics of Printed Circuit Boards Using Vias as Landmarks

Dr. Matthew J. Kay – Office of The Undersecretary of Defense (Research and Engineering)

SESSION III: PANEL DISCUSSION

Moderator: Saverio Fazzari – Booz Allen Hamilton

14:10 – 15:40

Impact of Standards on Additive Manufacturing

Speakers: Brandon Hamilton – BAE Systems, Sarah Adams – Johns Hopkins University Applied Physics Lab (JHU-APL), Dr. Alkim Akyurtlu – Printed Electronics Research Collaborative (PERC) at UMass Lowell.

15:40 – 16:00

Break


SESSION IV-A: Workshop I

Location: Mediterenian I

16:00 – 17:20

Army Outreach Session

Dr. Erin Gawron-Hyla– Army Research Laboratory, Dustin Mathias – Army Research Laboratory

SESSION IV-B: Paper Presentations

Chair: Dr. Santanu Bag – Huntington Ingalls Industries

16:00 – 16:20

Investigating the Effect of Electromagnetic Fault Injections on the Configuration Memory ofSRAM-based FPGA Devices

Alexandre Proulx– Thales Research and Technology Canada

16:20 – 16:40

X-Ray Fault Injection in non-volatile memories

Paul Grandamme– Laboratoire Hubert Curien, Universite Jean Monnet de Saint-Etienne

16:40 – 17:00

Robust Measurements for RF Fingerprinting with Constellation Patterns of Radiated Waveforms

Ameya Ramadurgakar– National Institute of Standards and Technology

17:00 – 17:20

A Modular Blockchain Framework for Enabling Supply Chain Provenance

Ujjwal Guin-Auburn University

17:20 – 19:00

Reception for Posters and Exhibits

Time

Day 2: October 25, 2023

7:20 – 8:20

Registration and Breakfast


Plenary Session III

Chair: Nathan Edwards – USPAE

8:20 – 9:00

Keynote Talk III: Microelectronics Commons

Dr. Alison Smith – Office of The Undersecretary of Defense (Research and Engineering)

9:00 – 9:20

Break

SESSION V: Invited Talk

Chair: Andrew King – L3Harris

9:20 – 9:40

A Review on CMP Challenges in HWB and Wafer Level packaging

Dr. Bahar Basim– Intel Corporation (Research and Engineering)

9:40 – 10:00

On-Shoring Assembly and Test for Advanced and Legacy Products

Sultan Lilani and Ted Tessier– Integra Technologies

10:00 – 10:20

Developing Secure Custom Silicon – Help Wanted!

Sid Allman – Marvell

10:20 – 10:40

Assured and Trusted Microelectronics Solutions (ATMS): Circuit Boards (PCB) exploring Potential Trustworthy Solutions for Printed and Commercial-Off-The-Shel (COTS) Components

Dr. Fathi Amsaad – Wright State University

10:40 – 11:10

Break


SESSION VI: Paper Presentations

Chair: Dr. Jinhui Wang – University of South Alabama

11:10 – 11:30

PLaNe: Reverse Engineering of Planar Layouts to Gate-Level Netlists

Maximilian Putz – Infineon Technologies AG

11:30 – 11:50

An Assessment of Sample Preparation Challenges in 3D Stacked Integrated Circuit Devices for Post-Silicon Verification and Validation

Noah Padro – Battelle Memorial Institute

11:50 – 13:30

Lunch and Exhibit


Plenary Session IV

Chair: Dr. Mike DiBattista – Varioscale

13:30 – 14:10

Keynote Talk IV: Challenges and Opportunities for 3D Heterogeneously Integrated Microsystems

Dr. Anna Tauke-Pedretti – DARPA

SESSION VII: PANEL DISCUSSION

Moderator: Kelsey Bramschreiber – NSWC Crane

14:10 – 15:40

Counterfeit Part Detection and Mitigation

Speakers: Dan DiMase – Aerocyonics, Inc., Frederick Schipp – Naval Surface Warfare Center, Sultan Lilani – Integra Technologies

15:40 – 16:00

Break


SESSION VIII-A: Workshop II

Location: Mediterenian I


SESSION VIII-B: Paper Presentations

Chair: Gregory Fritz – Draper

16:00 – 16:20

CMX-Ray: An X-ray Compatibility Metric for Advanced Packages to facilitate Design-for-Inspection

M Shafkat M Khan – UNIVERSITY OF FLORIDA

16:20 – 16:40

PQC Cloudization: Rapid Prototyping of Scalable NTT/INTT Architecture to Accelerate Kyber

Mojtaba Bisheh-Niasar – Microsoft

16:40 – 17:00

PALLET: Protecting Analog Devices using a Last-Level Edit Technique

Md Rafid Muttaki – UNIVERSITY OF FLORIDA

17:00 – 17:20

Non-Destructive Hardware Trojan Circuit Screening by Backside Near Infrared Imaging

Junichi Sakamoto – National Institute of Advanced Industrial Science and Technology

Time

Day 3: October 26, 2023

7:20 – 8:20

Registration and Breakfast


Plenary Session V

Chair: Dr. Health Berry – Radiance Technologies

8:20 – 9:00

Keynote Talk V: Criticality of Access to SOTA Microelectronics in a Global Supply Chain – Weighing Risks

Brett Hamilton– Applied Research Institute

9:00 – 9:20

Break


SESSION IX: Paper Presentations

Chair: Dr. Amin Yousefi – Meta

9:20 – 9:40

MeLPUF: Memory-in-Logic PUF Structures for Low-Overhead IC Authentication

Christopher Vega – University of Florida

9:40 – 10:00

IED_PUF Probe: A PUF-based Hardware Fingerprint Extraction Equipment for IEDs

Dr. TV Prabhakar – Indian Institute of Science, Bangalore

10:00 – 10:20

Exploring Security of Embedded SRAM in PIC and RISC-V Chips: Insights from Image Processing of Low-Cost Photon Emission Microscopy

Bahareh Ebrahimi Sadrabadi – University of Waterloo

10:20 – 10:40

Exploiting Hardware Imperfections for GPS Spoofing Detection using Clock Variations

Mirza Athar Baig – University of Nebraska-Lincoln

10:40 – 11:10

Break


SESSION X: Paper Presentations

Chair: Gill Duykers – Invariant Corporation

11:10 – 11:30

MicroBitstreams: Reducing Configuration Time of Encrypted Bitstreams

Christopher Sozio – Naval Surface Warfare Center Crane

11:30 – 11:50

RI-SAR: Randomized Input SAR ADC Resilient to Power Side Channel Attacks

Sumanth Karanth – The University of Texas at Austin

11:50 – 12:10

A sense of self for power side-channel signatures: Time-series Side-channel Disassembler and Integrity Monitor

Random Gwinn – The Johns Hopkins University Applied Physics Laboratory

12:10 – 12:30

Closing Remarks

General Chair and Program Chair

12:20 – 13:30

Lunch


Speakers

Dr. Marla Dowell

Director, CHIPS R&D Metrology Program and NIST Boulder Laboratory

Dr. Matthew J. Kay

Scientist for Trusted Microelectronics (SSTM) | OUSD(R&E) DCTO(CT) | Trusted & Assured Microelectronics Program Manager

Dr. Alison Smith

Microelectronics Commons Technical Director | OUSD(R&E) DCTO(CT)

Dr. Anna Tauke-Pedretti

Program Manager | Microsystems Technology Office (MTO) | DARPA

Brett Hamilton

SVP of Microelectronics & Advanced Technology Strategy – ARI | Advisor for the America’s Frontier Fund

Chris Peters

U.S. Partnership for Assured Electronics | Washington DC

Dr. Bahar Basim

Senior Staff Process Engineer, CMP Lead | Intel Corporation

Sid Allman

Senior Technical Director | Custom Silicon Solutions | Marvell Technology

Dr. Fathi Amsaad

Assistant Professor | Department of Computer Science | Wright State University

Dr. Franck Courbon

CEO and Founder Ethicronics Ltd | Cambridge, UK

Ted Tessier

Chief Technology Officer | Integra Technologies Inc.

Sultan Lilani

Director | Integra Technologies

Kelsey Bramschreiber

Navy JFAC HwA Operations Deputy | NSWC Crane

Fred Schipp

Electronics Engineer | Naval Surface Warfare Center

Dan DiMase

President & CEO | Aerocyonics, Inc.

Saverio Fazzari

Senior Lead Engineer | Booz Allen Hamilton

Sarah Adams

ssistant Program Manager | Alternative Computing Paradigms | Johns Hopkins University Applied Physics Lab (JHU-APL)

Brandon Hamilton

Program Manager | Microelectronics Packaging | BAE Systems

Dr. Alkim Akyurtlu

Director (UML), Raytheon UML Research Institute (RURI) | Director, Printed Electronics Research Collaborative (PERC) | UMass Lowell

Dr. Nathan Nakamura

NRC Postdoctoral Fellow | National Institute of Standards and Technology

Dr. Erin Gawron-Hyla

Research Chemist | US Army

Fabien Bouffard

Hardware Security Engineer | eShard

Alexander Quadrini

Army


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