Program | Speakers | Sponsorship | Winners | gallery
Time
November 11, 2024
19:00 – 21:00
HIR Special Session
Speakers:
HIR Overview: William Chen – ASE (U.S.) Inc.
Security: Navid Asadi – University of Florida
Modelling and Co-Design: Chris Bailey – Arizona State University
Metrology: Jan Vardaman – TechSearch International, Inc.
Time
Day 1: November 12, 2024
7:30 – 8:45
Registration & Breakfast
8:45 – 9:00
Opening Remarks – PAINE 2023 Awards
General Chair and Program Chair
Plenary Session I
Chair: Dr. Bahar Basim – Intel
9:00 – 9:40
Keynote Talk I: Challenges for Advanced Packaging in the Chiplet Era
Jan Vardaman -Tech Search International, Inc.
9:40 – 10:20
Keynote Talk II: Microelectronics Assurance
Jeff Krieg – National Security Agency
10:20 – 10:40
Break
SESSION I: Invited Talk
Chair: Dr. Je-Hyeong Bahk – University of Cincinnati
10:40 – 11:00
Extreme In-packaging Compute Density using Superconducting Materials and Cryogenic Cooling
Dr. Anna Herr – IMEC
11:00 – 11:20
Towards Digital Twin Standards in CMP Process as a Model for Advanced Packaging
Dr. Yaw Obeng – NIST
11:20 – 11:40
3DInterconnect Inspection for Chiplet Packaging using White-light Scanning and Phase Shifting Interferometry
Dr. Sang-Yoon LEE – Intekplus
11:40 – 12:00
Hybrid Bonding a Key Enabling Technology for Chiplet Integration
Dr. Charles Woychik – NHanced Semiconductors, Inc.
12:00 – 13:00
Lunch
Plenary Session II
Chair: Dr. Nick Hooten – Invariant Corp.
13:00 – 13:40
Keynote Talk III: CHIPS for America: An Update on the NSTC
Dr. Greg Yeric –National Semiconductor Technology Center
SESSION II: PANEL DISCUSSION I
Moderator: Saverio Fazzari – Booz Allen Hamilton
13:40 – 15:00
Advanced Packaging Technology Challenges for Assurance
Speakers: Dr. Carl McCant -DARPA | Dr. Len Orlando – Ansys Government Inititives (AGI) | Dr. Anthony Hill – Texas Instruments | Brandon Hamilton – BAE Systems, Inc. | Dr. Christopher Bailey – Arizona State University
15:00 – 15:30
Break
SESSION III-A: Paper Presentations
Chair: Dr. Biswajit Ray – Colorado State University
15:30 – 15:50
Fault-Injection Countermeasures, Deployed at Scale
Carlos Tokunaga – Intel Corporation
15:50 – 16:10
Physical Layout Extraction via Ion Milling based IC Delayering for Reverse Engineering Applications
Shuvodip Maitra – Indian Institute of Technology Kharagpur
16:10 – 16:30
CAKE-SiP: Chiplet Authenticate & Key Exchange for Secure Provisioning in System-in-Package
Md Sami Ul Islam Sami – University of Florida
14:30 – 14:50
“Computer Aided IC Reverse Engineering Methodology on the Basis of the TI DST80 Cryptographic Immobilizer Tag”
Markus Kammerstetter, Markus Muellner, Daniel Burian, Christian Kudera, and Wolfgang Kastner Trustworks KG – Techinical University of Wien
16:30 – 16:50
Evaluation of Terahertz Time Domain Spectroscopy for Uncovering Dosimetric Properties of Microelectronic Materials
Daniel Heligman – Riverside Research
SESSION III-B: Workshop I
Location: Discovery
15:30 – 17:00
Physical Investigation of Smartphones: Is Side-Channel Analysis Still Effective?
Lionel Rivière – eShard
16:50 – 17:50
Exhibit and Poster Session
17:50 – 19:00
Social Event
Time
Day 2: November 13, 2024
7:00 – 8:00
Breakfast
8:00 – 8:40
Keynote Talk IV :CHIPS for America: An Update on the NAPMP
Dr. George Orji – National Advanced Packaging Manufacturing Program
SESSION IV: Paper Presentations
Chair: Dr. Nelson Hastings – NIST
8:40 – 9:00
Reverse-Engineering and Data Extraction from SRAM using Photon Emission Analysis
Rodrigo Silva Lima – ALPhANOV – Mines Saint-Etienne
9:00 – 9:20
Securing Silicon Photonics Supply Chain Threats and Opportunities
Liton Kumar Biswas – University of Florida
9:20 – 9:40
Silicon Third-Party IP Verification and Validation for Post-Silicon Recovered Designs
Joshua Delozier – Battelle Memorial Institute
9:40 – 10:00
Assessing Magnetic Attack on Commercial 40nm pMTJ STT-MRAM
M. Sojib Ahmed – Colorado State University
10:00 – 10:30
Break
SESSION V: PANEL DISCUSSION II
Moderators:
Nathan Edwards – Rapid Innovation & Security Experts, Inc.
Dr. Erin Gawron-Hyla – DoD Microelectronics Commons
10:30 – 12:00
Working Toward Effective Microelectronics Workforce Development
DSpeakers: Hayley Atwater – DEVCOM Armaments Center | Dr. Tamara Moore – Purdue University | Mark T. McMeen – STI Electronics Inc. | Saverio Fazzari – Booz Allen Hamilton
12:00 – 13:00
Lunch and Exhibit
SESSION VI: Special Session on CHIPS Metrology
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13:00 – 13:45
Welcome and CHIPS Keynote
Dr. Paul Hale – CHIPS Metrology Deputy Director
13:45 – 15:15
CHIPS Metrology Funded Project Team Lightning Talks and Panel: Session I
Moderator: Antara Nandi, CHIPS Metrology Program Manager
Lightning Talks and Speakers:
Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology – Nathan Nakamura
Non-destructive Defect Detection Metrology for Semiconductor Advanced Packaging – Felix Kim
Electron-Solid Interactions – Dr. Andras Vladar
Time-resolved Emission Microscopy for Circuit Evaluation and Failure Analysis – Brandon Cage
Memory Device Characterization Platform – Karthick Ramu
Metrology for Integration of New Magnetic Materials – Dr. Jim Booth
15:15 – 15:30
Break
15:30 – 17:00
CHIPS Metrology Funded Project Team Lightning Talks and Panel: Session II
Moderator: Dr. Bob Keller, CHIPS Metrology Program Manager
Lightning Talks and Speakers:
Reliability of 2D and GaN – Dr. Elisabeth Mansfield
Accurate Cure Kinetics, Stress and Warpage Warpage Measurements for Next-Generation Microelectronics Packaging with High Thermo-Mechanical Reliability – Dr. Stian Romberg
Nanocalorimetry for Semiconductors and Semiconductor Process Metrology – Dr. Feng Yi
Characterization of Nano-to-Microscale Process-induced Thermomechanical Changes in Heterogeneously Integrated Micro-electronics – Dr. Gheorghe Stan
Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging – Richard A. Allen
Micromechanical Property Measurements of Materials for Heterogeneous Integration in Advanced Packaging – Dr. Li-Anne Liew
17:00 – 17:15
Closing Remarks – Dr. Paul Hale, CHIPS Metrology
Deputy Director
Time
Day 3: November 14, 2024
7:00 – 8:00
Breakfast
Plenary Session IV
Chair: Dr. Mike DiBattista – Varioscale Inc.
8:00 – 8:40
Keynote Talk V : Semiconductor Manufacturing and Advanced Packaging Supply Chain Security
Dr. Pauline Paki – Department of Homeland Security
8:40 – 9:10
Keynote Talk VI : Hardware Assurance for Chips: What Can We Learn from Failure Analysis Techniques?
Dr. Chee Lip Gan – Nanyang Technological University, Singapore
9:10 – 9:40
Break
SESSION VII: Paper Presentations
Chair: Parth Shah – Intel Corporation
9:40 – 10:00
Towards Reducing Costs of Side Channel Analysis for Real Time Algorithm Detection
Kevin Pintong – Binghamton University
10:00 – 10:20
Cover to Uncover: Comprehensive Study of Occlusion in DL-based SCA
Emanuele Strieder – Fraunhofer Institute for Applied and Integrated Security
10:20 – 10:40
Pre-Silicon Side-Channel Analysis of AI/ML Systems
Aydin Aysu – North Carolina State University
10:40 – 11:00
Break
SESSION VIII: Invited Talk
Chair: Dr. Hadi Kamali -University of Central Florida
11:00 – 11:20
Accelerating Innovation with Assurance
David Via – Midwest Microelectronics Consortium (MMEC)
11:20 – 11:40
Trust vs Risk: the Paradigm Shift in Critical Global Supply Chains
Dr. Andrew Stern – DUST Identity
11:40 – 12:00
TBD
Beau Bakken – Caspia Technologies
12:00 – 12:20
The Evolution of the Counterfeit Electronics Parts Threat and Advanced Mitigation Techniques
Jason Romano – SMT Corp
12:20 – 13:20
Lunch
SESSION IX: Paper Presentations
Chair: Dr. Ustun Sunay – Invariant Corp
13:20 – 13:40
SPICED: Syntactical Bug and Trojan Pattern Identification in A/MS Circuits using LLM-Enhanced Detection
Jayeeta Chaudhuri – Arizona State University
13:40 – 14:00
In-Situ FPGA Fault Injection with Short-Circuits
Garren Dutto – Oregon State University
14:00 – 14:20
Using Near-Field Electromagnetic Side Channels for Efficiently Fingerprinting Wireless Modules
Vishnuvardhan Iyer – National Institute of Standards and Technology/The University of Colorado Boulder
14:20 – 14:40
United We Protect: Protecting IP Confidentiality with Integrated Transformation and Redaction
Sudipta Paria – University of Florida
14:40 – 15:00
Dendritic Identifiers as Oracles in Microelectronics
Michael Kozicki – Arizona State University
15:00 – 15:20
Break
SESSION X: Paper Presentations
Chair: Dr. Aubrey Beal – The University of Alabama in Huntsville
15:20 – 15:40
Vision Transformers for Counterfeit IC Detection
Chaitanya Bhure – UNC Charlotte
15:40 – 16:00
Evaluating the Efficacy of the ResCav System in Distinguishing Integrated Circuits Across Manufacturers, Series, and Lots
Aditya Nechiyil – The Ohio State University
16:00 – 16:20
Adversarial Attack Against Golden Reference-Free Hardware Trojan Detection Approach
Ashutosh Ghimire – Wright State University
16:20 – 16:40
Enhancing Product Assurance and Reliability through a Machine Learning-Based Data Analysis System
Dohun Kim – Electronics and Telecommunications Research Institute
16:40 – 17:00
Broadening the Semiconductor Talent Pipeline with Non-Engineering Students
George Clark – University of South Alabama
17:00 – 17:10
